十．参数化设计
1、护垫参数化设计
ENTITY/BLK,C1,C2,C3,C4,C5,C6
DATA/L,102,W,30,H,10,S,55,D1,10,D2,8,KS,7 L1:
PARAM/'创建垫块','长',L,'宽',W,'高',H,$
'孔心距',S,'孔径',D1,'小圆孔径',D2,'孔深',KS,RSP JUMP/L1:,STOP:,,RSP
BLK=SOLBLK/ORIGIN,0,0,0,SIZE,L,W,H C1=SOLCYL/ORIGIN,(L/2-S/2),W/2,(H-KS),$ HEIGHT,KS,DIAMTR,D1
C2=SOLCYL/ORIGIN,(L/2+S/2),W/2,(H-KS),$ HEIGHT,KS,DIAMTR,D1
C3=SOLCON/ORIGIN,(L/2-S/2),W/2,0,$ HEIGHT,(H-KS),DIAMTR,D2,D1,AXIS,0,0,1 C4=SOLCON/ORIGIN,(L/2+S/2),W/2,0,$ HEIGHT,(H-KS),DIAMTR,D2,D1,AXIS,0,0,1 C5=unite/C1,WITH,C3 C6=UNITE/C2,WITH,C4 SUBTRA/BLK,WITH,C5
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SUBTRA/BLK,WITH,C6 STOP: HALT
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如果输入长小于孔径加孔距，则自动报错，显示输入不符。
2、垫片参数化设计
ENTITY/BLK,CYL1,CYL2 NUMBER/L,W,V,D,S
DATA/L,120,W,30,V,10,D,8,S,55 L1:
PARAM/'垫片参数','长',L,'宽',W,'高',V,'孔径',D,'孔距',S,RSP JUMP/L1:,STOP:,,RSP ifthen/L<(D+S)
messg/'输入不符！' jump/L1: endif
BLK=SOLBLK/ORIGIN,0,0,0,SIZE,L,W,V
CYL1=SOLCYL/ORIGIN,(L/2-S/2),(W/2),0,$
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HEIGHT,V,DIAMTR,D
CYL2=SOLCYL/ORIGIN,(L/2+S/2),(W/2),0,$ HEIGHT,V,DIAMTR,D SUBTRA/BLK,WITH,CYL1 SUBTRA/BLK,WITH,CYL2 STOP: HALT
如果输入长小于孔径加孔距，则自动报错，显示输入不符。
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