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前言---------------------------------------------------------------------------------------------------------------------4 简介---------------------------------------------------------------------------------------------------------------------6 1. 范围-----------------------------------------------------------------------------------------------------------------7 2. 参考文献-----------------------------------------------------------------------------------------------------------7 3. 术语，定义和缩写语------------------------------------------------------------------------------------------8 3.1 术语和定义---------------------------------------------------------------------------------------------------8 3.2 缩写语---------------------------------------------------------------------------------------------------------8 4. 取样介绍-----------------------------------------------------------------------------------------------------------9 4.1 绪言-------------------------------------------------------------------------------------------------------------9 4.2 对受限物质的要求和关切--------------------------------------------------------------------------------9 4.3 电子电器产品的复杂性和相关挑战-------------------------------------------------------------------9 4.4 取样策略------------------------------------------------------------------------------------------------------10 5. 取样------------------------------------------------------------------------------------------------------------------13 5.1 绪言-------------------------------------------------------------------------------------------------------------13 5.2 成品-------------------------------------------------------------------------------------------------------------14 5.3 部分拆分-------------------------------------------------------------------------------------------------------14 5.4 完全拆分-------------------------------------------------------------------------------------------------------14 5.5 部分拆解-------------------------------------------------------------------------------------------------------14 5.6 完全拆解-------------------------------------------------------------------------------------------------------15 5.7 取样拆分的注意事项---------------------------------------------------------------------------------------15 5.7.1 绪言------------------------------------------------------------------------------------------------------15 5.7.2 所需的样品大小--------------------------------------------------------------------------------------15 5.7.3 样品大小与检出限的关系-------------------------------------------------------------------------17 5.7.4 不可拆分样品的整体测试-------------------------------------------------------------------------17 5.7.5 非均一均质材料--------------------------------------------------------------------------------------18 5.7.6 均质材料取样位置的确定-------------------------------------------------------------------------19 6. 取样的结论和建议-----------------------------------------------------------------------------------------------19 7. 机械取样准备------------------------------------------------------------------------------------------------------20 7.1 概论--------------------------------------------------------------------------------------------------------------20 7.1.1 应用范围------------------------------------------------------------------------------------------------20 7.1.2 质量保证------------------------------------------------------------------------------------------------20 7.2 仪器，设备和材料------------------------------------------------------------------------------------------21 7.3 取样程序-------------------------------------------------------------------------------------------------------21 7.3.1 手工切割------------------------------------------------------------------------------------------------21 7.3.2 粗磨------------------------------------------------------------------------------------------------------22 7.3.3 均一化---------------------------------------------------------------------------------------------------22 7.3.4 细磨------------------------------------------------------------------------------------------------------22 7.3.5 聚合物和有机材料的超精细研磨---------------------------------------------------------------22 附录A（资料）取样拆分程序实例-----------------------------------------------------------------------------23 附录B（资料）管控物质出现的可能性----------------------------------------------------------------------32 附录C（资料）整体测试和取样--------------------------------------------------------------------------------35 附录D（资料）取样工具-----------------------------------------------------------------------------------------38 附录E（资料）移动电话拆解和元器件拆分---------------------------------------------------------------39
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图1-通用取样程序-------------------------------------------------------------------------------------------------11 图2-900um宽氧化铅电阻（SMD型）横截面------------------------------------------------------------19 图A.1-取样和拆分方法-------------------------------------------------------------------------------------------24 图A.2-DVD机取样--------------------------------------------------------------------------------------------------25 图A.3-CRT取样------------------------------------------------------------------------------------------------------26 图A.4-LCD电视机取样--------------------------------------------------------------------------------------------27 图A.5-PDA电话取样-----------------------------------------------------------------------------------------------28 图A.6-桌面电扇取样-----------------------------------------------------------------------------------------------29 图A.7-电子元器件取样-厚膜电阻------------------------------------------------------------------------------30 图A.8-电子元器件取样-SMD电势计--------------------------------------------------------------------------31 图D.1-用热气枪移除电子元器件-------------------------------------------------------------------------------38 图D.2-真空针移除目标电子设备-------------------------------------------------------------------------------38 图E.1-带有充电器和相机镜头盖的A型移动电话--------------------------------------------------------39 图E.2-可移除后盖的带有电池的A型移动电话------------------------------------------------------------40 图E.3-对B型电话部分拆解到主要元器件-------------------------------------------------------------------41 图E.4-键盘的完全拆分----------------------------------------------------------------------------------------------42 图E.5-底盖的完全拆分---------------------------------------------------------------------------------------------42 图E.6- 其他边框的完全拆分-------------------------------------------------------------------------------------43 图E.7-部分拆分后的移动电话的TFT屏-----------------------------------------------------------------------43 图E.8-部分拆分后的移动电话的主线路板-------------------------------------------------------------------44 图E.9-引线框架电子元器件的拆分-----------------------------------------------------------------------------46 图E.10-拆分前的BGA封装----------------------------------------------------------------------------------------47 图E.11-手工程序移除后的BGA封装--------------------------------------------------------------------------47 图E.12-手工程序移除的BGA中的锡球-----------------------------------------------------------------------48 图E.11-用球型剪制备的BGA中锡球--------------------------------------------------------------------------48
表1-分析测试需要的最少量的引线框架样品---------------------------------------------------------------16 表2-复合样品中的管控物质的风险水平----------------------------------------------------------------------18 表B.1-电子电器材料和元器件中管控物质出现的可能性------------------------------------------------32 表C.1-基于检出限计算的复合电子元器件的最大浓度---------------------------------------------------36
表C.2-基于复合电子元器件中最大允许浓度计算的检出限----------------------------------------------37 表E.1-移动电话中可能出现的管控物质----------------------------------------------------------------------40 表E.2-移动电话主要元器件中可能出现管控物质----------------------------------------------------------41 表E.3-典型小电子元器件的拆分举例-------------------------------------------------------------------------45