Pad Designer（Cadence焊盘制作）
1.打开软件........................................................................................................................................ 3
1.Pad Designer（用于制作过孔、表贴、通孔焊盘） ...................................... 3
2.PCB Editor（用于制作Flash热风焊盘，PCB封装库） ................................ 4
2.焊盘的制作 ................................................................................................................................... 6
1.热风焊盘的制作（Flash） ................................................................................................... 6 2.通孔焊盘制作 ....................................................................................................................... 7 3.贴片焊盘制作 ....................................................................................................................... 8 4.过孔的制作 ......................................................................................................................... 10 5.MARK点的制作 .................................................................................................................. 12 3.修改添加器件焊盘、PCB封装、MARK点、过孔库路径 ....................................................... 14 4.元件封装的制作 ......................................................................................................................... 15
1.打开PCB Editor软件 ......................................................................................................... 15 2.创建元器件封装 .................................................................................................................. 15 3.设置图纸尺寸 ...................................................................................................................... 16 4.设置格点 .............................................................................................................................. 16 5.放置焊盘 .............................................................................................................................. 17 6.加入装配层框 ...................................................................................................................... 18 7.加入丝印框 .......................................................................................................................... 18 8.放置Place Bound（防止器件重叠） ................................................................................ 19 9.放置参考编号 ...................................................................................................................... 19 10.File------Save As保存在器件库路径下 ............................................................................ 20
设计目的：制作一个USB的PCB封装，如图：
1.打开软件
1.Pad Designer（用于制作过孔、表贴、通孔焊盘）