毕 业 设 计（论 文）
题目：基于ARM9-S3C2410数字核心板的硬件设计
Title：Hardware Design of Digital Core Board Based on ARM9-S3C2410
二零一零年六月
摘 要
三星S3C2410微处理器是一个采用ARM920T内核，高性能、低功耗、低成本的16/32位RISC处理器。基于S3C2410的最小系统核心板是一个独立模块，根据需求它可以直接与用户板模块结合进行速度、快捷、费用合理的开发利用。
本课题的主导内容是基于S3C2410的最小系统的核心板的硬件设计，测试部分用到了自行设计的简易测试用底板。硬件部分的设计是应用Protel 99 SE软件完成的，综合了许多原理图设计思想，进行取优弃弊，结合实际应用的考虑，以功能模块思想作引导，认真核对每一个引脚及其网络连接，采用六层板，通过原理图的绘制，原理图的修改，PCB的布局布线再经过印刷、安装器件形成核心板。
该设计自主开发出的核心板，具有低功耗、小体积、低成本、高性能、稳定、低干扰、良好的可观察性的良好特点。可以进行各种需求的教学实验及开发，为我们自己设计的一些仪器提供了良好的核心支持。
关键词： ARM9； 最小系统； 核心板； S3C2410
ABSTRACT
The SAMSUNG's S3C2410A 16/32-bit RISC microprocessor is a product designed with cost-effective, low-power, and high-performance. The S3C2410 was developed using an ARM920T core. The core board with minimum based on the S3C2410 is a independent modules. combined directly with user board it could be given a utilization as client’s need speed, fast and reasonable-cost.
The lead content of this topic is the hardware design of core board with minimum based on the S3C2410 tested with a simple user board designed by myself. Integrating many ideas, cosidering the practical application, and bringing essence together finally the core board was completed after the schematic is drew and modified, the PCB board is arranged and routed, then components fixed on the six-lamellar board.with the software Protel 99 SE.
The core board has advantages of low power consumpution, small size, low cost, high performance, stability, low interference and convenient observability.
Key words：ARM9; minimum system; core board; S3C2410
目 录
绪 论 ........................................................................................................................... 1
1.1 嵌入式系统的发展及应用 .......................................................................... 1
1.1.1 嵌入式系统的发展史 ....................................................................... 1 1.1.2 嵌入式系统的发展现状及未来趋势 ............................................... 1 1.2 课题的意义和内容 ...................................................................................... 3
1.2.1 研究意义 ........................................................................................... 3 1.2.2 课题内容 ........................................................................................... 3
2．基于ARM9-S3C2410的最小系统 ....................................................................... 4
2.1 S3C210概述 ................................................................................................ 4
2.1.1 S3C210芯片简介 ............................................................................. 4 2.1.2 引脚定义 ........................................................................................... 6 2.1.3 引脚信号描述 ................................................................................... 7 2.2 基于ARM9-S3C2410最小系统的分析 ..................................................... 8
2.2.1 基于ARM9-S3C2410最小系统的需求分析 .................................. 8 2.2.2 基于ARM9-S3C2410最小系统的设计及系统测试流程 ............ 10
3．基于ARM9-S3C2410核心板的硬件设计 ......................................................... 11
3.1 PROTEL 99 SE简介.................................................................................. 11 3.2 核心板硬件规划图 .................................................................................... 11 3.3 核心板硬件的芯片介绍 ............................................................................ 12
3.3.1 S3C2410简介 ................................................................................. 12 3.3.2 电源芯片SPX1117简介 ................................................................ 12 3.3.3 系统存储芯片简介 ......................................................................... 12 3.3.4 晶振芯片 ......................................................................................... 15 3.4 核心板硬件功能模块的原理图设计 ........................................................ 16
3.4.1 核心板硬件原理图 ......................................................................... 16 3.4.2 电源管理部分 ................................................................................. 18 3.4.3 系统存储部分 ................................................................................. 19 3.4.4 总线驱动 ......................................................................................... 21 3.4.5 系统复位电路 ................................................................................. 22 3.4.6 系统时钟部分 ................................................................................. 23 3.5 核心板硬件的PCB图设计 ....................................................................... 24
3.5.1 核心板的PCB图 ............................................................................ 24 3.5.2 核心板的PCB布局 ........................................................................ 25
东华理工大学毕业设计（论文） 基于ARM9-S3C2410的最小系统
3.5.3 核心板的PCB分层设计 ................................................................ 26 3.6 核心板硬件的设计结果 ............................................................................ 29 3.7 核心板功能简介 ........................................................................................ 30
3.7.1 核心板引脚功能 ............................................................................. 31 3.7.2 核心板GPIO口 .............................................................................. 32
4．硬件测试与分析 ................................................................................................... 33
4.1 硬件测试介绍 ............................................................................................ 33 4.2 测试流程及结果分析 ................................................................................ 35 结论与展望 ................................................................................................................. 36 致 谢 ......................................................................................................................... 37 参考文献 ..................................................................................................................... 38 附录1 .......................................................................................................................... 39 附录2 .......................................................................................................................... 46 附录3 .......................................................................................................................... 53