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2006-09-24

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IPC-D-325A Documentation Requirements for Printed Boards Ó¡ÖÆ°åÉè¼ÆÎļþͼ²áÒªÇó

IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly Ó¡ÖÆ°åÖÆÔìºÍ×é×°µÄ¹ÊÕÏÅųý

IPC-6010 Series IPC-6010 Qualification and Performance Series IPC-6010Ó¡ÖÆµç·°åÖÊÁ¿±ê×¼ºÍÐÔÄܹ淶ϵÁÐÊÖ²á

IPC-6011 Generic Performance Specification for Printed Boards Ó¡ÖÆ°åͨÓÃÐÔÄܹ淶

IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)

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IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

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IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

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IPC-6018A Microwave End Product Board Inspection and Tech ΢²¨³ÉÆ·Ó¡ÖÆ°åµÄ¼ìÑéºÍ²âÊÔ

IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections

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IPC-A-600F Acceptability of Printed Boards Ó¡ÖÆ°åÑéÊÕÌõ¼þ

IPC-QE-605A Printed Board Quality Evaluation Handbook Ó¡ÖÆ°åÖÊÁ¿ÆÀ¼Û

IPC-QE-605A-KIT Hard Copy and CD Ó¡ÖÆ°åÖÊÁ¿ÆÀ¼ÛÊéºÍ¹âÅÌ(CD)

IPC-HM-860 Specification for Multilayer Hybrid Circuits ¶à²ã»ìºÏµç·¹æ·¶

IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards ¾ÛºÏÎïºñĤӡ֯°åµÄ¼ø¶¨ÓëÐÔÄÜ

IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards

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IPC-TR-481 Results of Multilayer Tests Program Round Robin ¶à²ãÓ¡ÖÆ°åÁªºÏÊÔÑ鼯»®½á¹û

IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components ÓÃÓÚµç×ÓÔª¼þ°²×°Ó뻥Á¬µÄÓ¡ÖÆ°åÖÊÁ¿ÆÀ¼Û

IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs

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IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards

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IPC-DR-572 Drilling Guidelines for Printed Boards Ó¡ÖÆ°å×ê¿×µ¼Ôò

IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias Ó¡ÖÆ°åͨ¿×»ú¼Ó¹¤·½°¸µÄ¸Ä½øºÍÓÅÑ¡ÊÖ²á

IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers ×ê´²ºÍϳ´²ÓüÆËã»úÊý×Ö¿ØÖƸñʽ

IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines Ê©¼Ó×躸ǰ¼°Ê©¼ÓºóÇåÏ´µ¼Ôò

IPC-HDI-1 High Density Interconnect Microvia Technology Compendium ¸ßÃܶÈ(HDI)»¥Á¬Î¢Í¨¿×¼¼Êõ¸ÙÒª

IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia

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