閲戝睘鐢甸晙鐨勫熀鏈父璇嗕笌闂瓟
1. 1
鐢甸晙瀹氫箟
鐢甸晙
(electroplating)
鏄竴绉嶇數绂诲瓙娌夌Н杩囩▼
(electrodepos- ition process)
锛?/p>
鏄埄鐢ㄧ數鏋?/p>
(electrode)
閫氳繃鐢垫祦锛屼娇閲戝睘闄勭潃鍦ㄧ墿浣撹〃闈笂锛屽叾鐩殑涓?/p>
鏀瑰彉鐗╀綋琛ㄩ潰鐨勭壒鎬ф垨灏哄銆?/p>
1. 2
鐢甸晙鐩殑
鏄湪鍩烘潗涓婇晙涓婇噾灞為晙灞?/p>
(deposit)
锛?/p>
鏀瑰彉鍩烘潗琛ㄩ潰鎬ц川鎴栧昂瀵搞�?/p>
渚嬪璧?/p>
浜堥噾灞炶〃闈㈢殑鍏夋辰缇庤銆?/p>
鐗╁搧闃查攬銆?/p>
闃叉纾ㄨ�楋紱
鎻愰珮瀵肩數搴︺�?/p>
娑︽粦鎬с�?/p>
寮哄害銆佽�愮儹鎬с�佽�愬�欐�э紱鐑鐞嗙殑闃叉笚纰炽�佹爱鍖栵紱灏哄鎴栫（鑰楃殑闆朵欢
淇ˉ銆?/p>
1. 3
鍚勭闀�閲戞柟娉?/p>
鐢甸晙娉?/p>
(electroplating)
鏃犵數闀�娉?/p>
(electroless plating)
鐑蹈娉?/p>
(hot dip plating)
鐔斿皠鍠烽晙娉?/p>
(spray plating)
濉戞枡鐢甸晙
(plastic plating)
娴告笉鐢甸晙
(immersion plating)
娓楅�忛晙閲?/p>
(diffusion plating)
闃存瀬婧呴晙
(cathode supptering)
鐪熺┖绂诲瓙鐢甸晙
(vacuum plating)
鍚堥噾鐢甸晙
(alloy plating)
澶嶅悎鐢甸晙
(composite plating
灞�閮ㄧ數闀�
(selective plating)
绌垮瓟鐢甸晙
(through-hole plating)
绗旂數闀�
(pen plating)
鐢甸摳
(electroforming)
1.4
鐢甸晙鍩烘湰鐭ヨ瘑